The Design of an Adaptive Multi-Material Fully Automated Grinding and Polishing Machine

With the increasing demand for material microimaging analysis, there is a growing need for advanced precision grinding and polishing equipment, especially for metals, ceramics, and composites. Existing automated systems struggle with handling complex material challenges. This paper presents a fully automated adaptive grinding and polishing machine based on an STM32 microcontroller that handles multi-material samples. The system includes modules for sample access, cleaning, pad replacement, human-computer interaction, and equipment communication. The STM32 microcontroller executes grinding and polishing tasks based on instructions from the host computer while dynamically adjusting PID control parameters using an improved weighted average optimization algorithm. This approach enhances control accuracy, stability, and overall surface treatment quality compared to traditional PID control methods.