Piezoelectric ultrasonic coupling-based polishing of micro-tapered holes with abrasive flow

The primary determinant of microfluidic chip performance is the surface quality of the micro-tapered holes. Due to the small scale of these holes and the high hardness of the surface attachments, the commonly used abrasive jet polishing method can encounter difficulties. Therefore, we propose a novel active multiphase field material removal technique. This technique is based on piezoelectric ultrasonically coupled abrasive particle flow. To study the connection between the impulse properties of the flow field and the micro-tapered hole’ s asymptotic expansion–contraction process, a multiphase hybrid fluid dynamics model is established. Simultaneously, we investigate the process of abrasive–wall contact during the cycles of expansion and contraction, revealing the effects of erosion and polishing on different areas of the hole surface. To achieve accurate regulation of a desired polishing area, a quantitative relationship between the vibrational properties of piezoelectric ceramics and the erosional effect of micro-tapered holes is established. Finally, an experimental platform for micro-tapered hole polishing is built to validate the method.