Yinxuan Zhu, Ashley Wissel-Garcia, Kidus Guye, Chandan Joishi, Can Cao, Seungheon Shin, Kyle Liddy, Emils G. B. Jurcik, Agnes Maneesha Dominic Merwin Xavier, Andrew A. Allerman, Brianna Klein, Andrew Armstrong, James S. Speck, Samuel Graham, Siddharth Rajan
We report on the design and experimental demonstration of ultra-wide-bandgap AlGaN polarization-graded field-effect transistors (PolFETs) with ultra-thin channels aimed at enabling high current capability, RF performance, and reduced thermal resistance. Polarization-graded AlGaN layers and ultra-thin pseudomorphic AlGaN buffer layers are employed to achieve low thermal resistance while maintaining high structural quality. The demonstrated PolFETs achieve a maximum soft-saturation drain current density of 800 mA/mm at VG = 4 V and ∼500 mA/mm at VG = 0 V, along with current- and power-gain cutoff frequencies (fT/fmax) of 26/28 GHz, respectively. Small-signal modeling was performed to analyze parasitic and transit delays, and gate-resistance thermometry was implemented to characterize device thermal behavior and benchmark against state-of-the-art AlGaN HEMTs. The ultra-thin AlGaN PolFET exhibits a thermal resistance of 12 K mm/W, representing a significant reduction compared to conventional AlGaN transistor structures. These results demonstrate the feasibility of polarization-engineered ultra-wide-bandgap AlGaN transistors for RF and mm-wave applications, with the added advantage of improved thermal performance.