Yingzhe Li, Weiwei Li, Manzhang Xu, Ruoyan Miao, Zheng Liu, Lu Zheng, Guang Pan, XM. Wang, W Huang
growth of highly conductive molybdenum patterns directly on flexible micas afforded strong bonding and adhesion between circuits and flexible substrates. Thermal stress mismatch was significantly suppressed, enhancing the stability and signal-to-noise ratios of flexible devices up to 400 °C. Flexible and thermally regulable electronic devices, including amplifiers, low-pass filters, and wave generators, were constructed for high-temperature applications. Additionally, the seamless integration of these devices with a machine learning algorithm enables the realization of flexible sensing systems for real-time engine state monitoring and high-temperature information filtering. The proof-of-concept strategy offers a unique route for designing flexible sensing electronic devices, integrated circuits, and systems resistant to extreme-temperature conditions.