Qingxia He, Heng Zhang, Zhixing Zhang, Yanshuai Duan, Mengmeng Qin, Wei Feng
Dynamic Interface Thermal Management In their Research Article (10.1002/adfm.202520631), Wei Feng, Mengmeng Qin, and co-workers draw inspiration from the radial structure of dandelion to develop an innovative, custom-composite strategy tailored for elastic thermal interface materials (TIMs). By constructing dandelion-inspired microspheres, they create a synergistically enhanced 3D thermal network featuring high thermal conductivity and excellent mechanical compliance. This 3D thermal networks-based TIMs exhibit stable and efficient thermal management capabilities under dynamic stress, paving the way for advanced thermal management in next-generation flexible electronics and aerospace systems.