Review of Progress in Polymer‐Based Interfacial Thermal Management Composites

ABSTRACT Contemporary electronic devices are evolving toward higher integration and power density, which has intensified the conflict between rapid heat accumulation and limited dissipation space. This issue has become a major constraint on device performance and operational safety. Thermal interface materials (TIMs) play a vital role in thermal management systems. However, incomplete thermal pathways formed during the manufacturing process can compromise thermal conductivity and even introduce safety risks. Therefore, the development of high‐performance TIMs holds significant practical importance. This review examines the mechanisms of interfacial thermal management and evaluates the effectiveness of various structural design strategies. It further explores the selection and modification of diverse functional fillers, interfacial engineering strategies, composite fabrication methods, and machine learning‐assisted design, highlighting their contributions to enhancing interfacial thermal management performance. In addition, the article covers a range of processing techniques used in the production of these advanced materials, highlighting the versatility and scalability potential of polymer‐based interfacial thermal management composites. The key strength of this review lies in its consolidation of current knowledge, along with its discussion of future applications, existing challenges, and emerging directions for polymer‐based interfacial thermal management composites.