Trong Danh Nguyen, Jun Seop Lee
Polymer adhesive materials have been utilized across a wide range of applications, including adhesion to wood, metals, and biomaterial substrates. To meet increasing performance demands, the development of high-performance adhesive materials continues to be actively pursued by introducing advanced functions and capabilities into polymer networks. By incorporating dynamic covalent bonds into the polymer network, these materials gain self-healing and reprocessing abilities. While these materials exhibit high mechanical robustness and stability under service conditions, the bonding/rebonding reactions of dynamic covalent bonds allow the polymers to detach from target surfaces when needed. Additionally, noncovalent interactions within the network and between the polymer and the target surface significantly contribute to overall adhesive strength. Although dynamic covalent bonds and noncovalent interactions operate through different mechanisms, both contribute significantly to adhesive performance. This review manuscript presents studies on polymer networks containing dynamic covalent bonds and non-covalent interactions. Based on these studies, the respective contributions of each type of bond to the superior adhesive strength of the materials are discussed, and potential target substrates for adhesion, including wood, metal, and biomaterials, are proposed.