High-Uniformity Core-Shell Nanofibers for Semiconductor Packaging: Process Optimization and Performance Study of Airflow-Assisted Coaxial Electrospinning

Semiconductor miniaturization demands stricter material uniformity. Core-shell nanofibers, promising for semiconductor packaging and flexible circuits, face application limits due to traditional coaxial electrospinning's electric field instability-causing poor fiber diameter uniformity and challenges with high-viscosity and low-conductivity solutions. To address this, airflow-assisted coaxial electrospinning leveraged airflow-electric field synergy to enhance fiber stretching. COMSOL Multiphysics 6.4 simulated the influence of different inner diameters of the air flow nozzles on the air flow field, while the response surface method optimized parameters. At 10 kPa air pressure, 16.71 kV voltage, and a gas nozzle inner diameter of 3.42 mm, nanofibers showed regular morphology with a diameter coefficient of variation as low as 9.2%. This study enables stable preparation of highly uniform core-shell nanofibers, providing key process support for their large-scale semiconductor application and advancing flexible electronics and photodetection.