Thermal Side-Channel Threats in Densely Integrated Microarchitectures: A Comprehensive Review for Cyber–Physical System Security

Densely integrated microarchitectures spanning three-dimensional integrated circuits (3D-ICs), chiplet-based designs, and system-in-package (SiP) assemblies make heat a first-order security concern rather than a mere reliability issue. This review consolidates the landscape of thermal side-channel attacks (TSCAs) on densely integrated microarchitectures: we systematize observation vectors and threat models, clarify core concepts and assumptions, compare the most credible evidence from the past decade, and distill the main classes of defenses across the hardware-software stack. We also explain why hardening against thermal leakage is integral to cyber-physical system (CPS) security and outline the most promising research directions for the field. The strategic relevance of this agenda is reflected in current policy and funding momentum, including initiatives by the United States Department of Homeland Security and the Cybersecurity and Infrastructure Security Agency (DHS/CISA) on operational technology (OT) security, programs by the National Science Foundation (NSF) on CPS, and Canada's Regional Artificial Intelligence Initiative and Cyber-Physical Resilience Program (RAII, >CAD 35 million), to bridge advanced microelectronics with next-generation cybersecurity. This survey offers a clear, high-level map of the problem space and a focused baseline for future work.