W. Liu, Xingyu Zhao, Hongliang Li, Yi Ding
The persistent conflict between strength and electrical conductivity in copper-based materials presents a fundamental limitation for next-generation high-performance applications. Graphene, with its unique two-dimensional architecture and exceptional intrinsic characteristics, has become a promising reinforcement phase for copper matrices. This comprehensive review synthesizes recent advancements in graphene–copper composites (CGCs), focusing particularly on structural design innovations and scalable manufacturing approaches such as powder metallurgy, molecular-level mixing, electrochemical deposition, and chemical vapor deposition. The analysis examines pathways for optimizing key properties—including mechanical strength, thermal conduction, and electrical performance—while investigating the fundamental reinforcement mechanisms and charge/heat transport phenomena. Special consideration is given to how graphene morphology, concentration, structural quality, interfacial chemistry, and processing conditions collectively determine composite behavior. Significant emphasis is placed on interface engineering strategies, graphene alignment, consolidation control, and defect management to minimize electron and phonon scattering while improving stress transfer efficiency. The review concludes by proposing research directions to resolve the strength–conductivity paradox and broaden practical implementation domains, thereby offering both methodological frameworks and theoretical foundations to support the industrial adoption of high-performance CGCs.