Shuang Li, Jianyu Zhou, Miao Miao, Kunpeng Qian, Jianhui Fang, Xin Feng
Optimizing the structural design of electromagnetic interference (EMI) shielding materials to enhance their effectiveness, mechanical properties, and thermal management remains a significant challenge. In this work, a sandwich-structured copper@aramid nanofiber/Ti3C2Tx MXene (Cu@ANF/MXene) composite film with high mechanical strength and thermal conductivity was achieved via a straightforward electroless deposition process. Crucially, Ti3C2Tx MXene serves dual roles: reinforcing the ANF matrix and sensitizing the formation of Ag seeds to facilitate subsequent Cu deposition, rather than merely acting as a conductive filler. The sandwich-structured film achieves an exceptional maximum EMI shielding effectiveness of 102.7 dB, while simultaneously integrating robust mechanical properties (149.7 MPa) and superior thermal conductivity (40.7 W m‒1 K‒1). Remarkably, the sandwich-structured film exhibits a 34.5 dB enhancement in EMI shielding effectiveness compared to its non-sandwich counterpart under identical conditions, unequivocally demonstrating the critical importance of architectural optimization. This multifunctional performance underscores the significant potential of the metal@aramid composites for advanced EMI shielding applications.