Zhengtong Yao, Bin Liu, Shuai Zhang, Quanxin Guo, Yutao Han, Zhihao Guan, Kun Yang, Wenpei Gao, Yakun Yuan, Zhenhua Wu, Moran Wang, Zhiyu Hu
More than half of global primary energy is dissipated as low-grade waste heat, yet thermoelectric conversion remains constrained by the intrinsic coupling between phonon and charge transport. Here, we introduce graded interfacial size distribution as a thermodynamic design variable that breaks translational symmetry in multilayers, enabling anisotropic regulation of phonon-carrier transport. Using bismuth telluride (Bi2Te3)/metal [gold, silver, and platinum (Pt)] multilayers as a model system, we demonstrate that multiscale interface distributions induce broadband phonon suppression through the coexistence of interfacial scattering, coherent interference, and localization. This yields an ultralow cross-plane thermal conductivity of 0.22 watts per meter per kelvin and a high room-temperature ZT of 1.51 in Bi2Te3/Pt films. Concurrently, asymmetric metal-semiconductor interfaces create quasi-two-dimensional accumulation channels that enhance in-plane carrier mobility while preserving energy filtering, delivering a power factor of 176.2 microwatts per centimeter per square kelvin at 300 kelvin. The graded architecture enables high performance in both vertical and flexible planar devices, illustrating a general strategy in which interface distribution, not merely composition, governs anisotropic heat-charge transport. Our findings establish statistical interface engineering as a platform for thermoelectric energy harvesting and solid-state cooling.