State of the Art and Outlooks of Cu–Cu Hybrid Bonding

In this study, the state-of-the-art and outlooks of Cu-Cu hybrid bonding (HB) will be investigated. Emphasis is placed on the design, materials, process, fabrications, reliability, challenges, advantages and disadvantages, and examples of Cu–Cu HB. Specially, the works by Sony, Samsung, Applied Materials, EV Group, imec, Daicel Corporation, High Energy Accelerator Research Organization, Toray Industries, Entegris, National Yang Ming Chiao Tung University, Industrial Technology Research Institute, MediaTek, National Tsing Hua University, BASF, STMicroelectronics, CEA-Leti, Binghamton University, IBM, TAZMO, LINTEC, Institute of Science Tokyo, TSMC, Seoul National University of Science and Technology, YOKOHAMA National University, Tokyo Electron Kyushu Limited, SK Hynix, Tokyo Electron Limited, Toray, DISCO, University of Tsukuba, Kurita Water Industries, and Unimicron will be presented and discussed. Also, some recommendations will be provided.