J Zhang, Peng Wang, Hangyu Miao, Miaohong Wei, Zhe Li, Ziheng Zheng, Wei Duan, Ying Yue
The rapid advancement of silicone resin additive manufacturing has enhanced printing precision and speed, yet challenges, such as limited elasticity and functionality persist. This study introduces a highly elastic, self-healing photocurable silicone resin (HPSR) based on thiol-ene chemistry, using thiol-grafted poly(dimethylsiloxane) (PDMS-SH) and hydroxyethyl acrylate. The resulting HPSR demonstrates exceptional elongation at break (1336%) and efficient thermally induced self-healing, achieving 98.7% recovery efficiency. Its high elasticity also reduces cracking from curing shrinkage. By incorporating surface-modified boron nitride, the photocured composite (HPSR-BN) attains superhydrophobicity, with a water contact angle of 158° and a roll-off angle of 3°, alongside the improved thermal conductivity (1.356 W·m –1 ·K –1 ). Furthermore, owing to its superhydrophobic properties, HPSR-BN exhibits an excellent anti-icing performance. Not only does it maintain an ice adhesion strength below 25 kPa after 30 icing/deicing cycles, but the insulators fabricated from HPSR-BN also demonstrate ice accumulation that is only 1/10 that of porcelain insulators during a 1 h freezing rain test. Leveraging dynamic disulfide bonds, the resin enables the recycling of used prints. This multifunctional BN-reinforced composite holds promise for complex power equipment components and related applications.