Exploring design configurations of micro heat sink for thermal performance management and heat transfer augmentation

The ongoing trend toward miniaturization and increasing power densities in electronic devices has created significant challenges in managing the resulting heat. Overheating in electronic components can lead to performance degradation, reduced efficiency, and even permanent failure. Heat sinks play a vital role in thermal management, ensuring that devices such as CPUs, GPUs, and LEDs operate within safe temperature limits. This review manuscript presents an overview of the latest advancements in heat-sink configurations, heat-transfer enhancement techniques, and advanced optimization strategies for electronic cooling. It highlights key innovations—including microchannels, porous structures, and vortex generators—that contribute to improved thermal performance and energy efficiency. Additionally, the review discusses enhanced geometrical designs and materials, such as pin fins, plate fins, and perforated structures, which help increase heat dissipation while minimizing pressure drop. The study emphasizes how optimized heat-sink designs address challenges related to compactness, reliability, and sustainability, supporting the growing needs of modern technologies. It also serves as a comprehensive reference for engineers and researchers seeking to improve thermal management solutions in electronic systems. Future research is recommended to explore novel configurations and integrate advanced materials for broader applications and enhanced thermal efficiency.