Materials and design strategies for interposer-based packaging: A comparative review of silicon, glass, and organic platforms

In heterogeneous integration packaging, interposers are fundamental components that provide high bandwidth, low latency, and die-to-die connections by integrating multiple functional dies, such as logic and memory, within a single package. They have also gained significant attention for addressing challenges that are increasingly difficult to resolve through process scaling alone, such as rising power density, declining reliability, and memory walls. Packaging technologies are expected to become increasingly miniaturized and integrated as the demand for high-performance computing continues to increase in the fields of artificial intelligence, big data, and data center systems. Interposers provide high-density, die-to-die interconnects by combining fine-pitch wiring with through-via and through-via-less connections. In this review, we compare and summarize silicon, glass, and organic interposer technologies from material and structural perspectives, and discuss future research directions and applications, considering the advantages and limitations of each approach.