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◆ Materials (Basel, Switzerland)2026-08-14

A Review and Research Proposal on Pioneering Sustainable Unmanned Aerial Vehicles (UAVs) with Kenaf Fibre Biocomposites for Structural and Electronic Integration.

Thinesh Sharma Balakrishnan, Khalina Abdan, Krzysztof Nozdrzykowski, Rafał Grzejda, Mohd Radzi Ali, Suhas Yeshwant Nayak, Anand Pai

原始摘要(英文原文)· Original abstract
Unmanned aerial vehicles (UAVs) are experiencing rapid growth across diverse sectors, creating an increasing demand for lightweight, high-performance and environmentally sustainable materials. Conventional drone materials offer excellent mechanical properties but pose environmental concerns due to their high carbon footprint, energy-intensive production and limited biodegradability. Kenaf fibre, a renewable natural fibre, presents a promising alternative owing to its low density, high specific strength, cost-effectiveness and eco-friendly characteristics. This review and research proposal explores the current and potential applications of kenaf-based materials in drone manufacturing, including kenaf fibre-reinforced biocomposites, pressed paper, composite pellets and 3D printing filaments for structural, functional and electrical housing components. Kenaf-based materials have demonstrated mechanical strengths approaching 300 MPa, dielectric constants of approximately 2.5 and electrical breakdown strengths exceeding 150 kV/mm, highlighting their potential for lightweight UAV structures and electronic insulation applications. The proposed research focuses on optimising kenaf fibre treatment, fibre-matrix compatibility, hybrid reinforcement strategies and additive manufacturing parameters to develop lightweight, durable and multifunctional kenaf-based UAV components. The framework aims to establish a systematic pathway for the development and validation of kenaf-based materials for next-generation sustainable UAVs.
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A Review and Research Proposal on Pioneering Sustainable Unmanned Aerial Vehicles (UAVs) with Kenaf Fibre Biocomposites for Structural and Electronic Integration. — 科研速览 Science Skim