The effect of novel silica-based polishing solution on the UV-CMP performances of K9 optical glass

K9 optical glass is widely recognized as an excellent development material for optical imaging applications. However, it is necessary to improve the surface quality and processing efficiency of optical glass. This paper developed a novel silica solution incorporating K 2 CO 3 and 3-aminopropyltriethoxysilane (C 9 H 23 NO 3 Si, KH550) for ultrasonic vibration chemical-mechanical polishing (UV-CMP) of optical glass. The effects of SiO 2 abrasives, pH value, K 2 CO 3 , KH550 and ultrasonic amplitude on the UV-CMP performance of optical glass were investigated for the silica solution system. The results indicate that when the solution contained 12 wt% SiO 2 abrasive, 1.5 wt% K 2 CO 3 , 1.6 wt% KH550, and axial ultrasonic amplitude of 6 μm, the optimal UV-CMP performance was achieved with surface roughness Sa and Ra values of 54.07 nm and 41.15 nm respectively, and material removal rate (MRR) of 0.073 mm 3 /min. X-ray photoelectron spectrometry (XPS) analysis showed that an increase in axial ultrasonic amplitude facilitated a decrease in the valence ratios of SiO 2 and C-NH 3 + , while enhancing the valence ratios of amino silane (Si-O), silanol (Si-OH) and C-NH 2 . Based on this, A new material removal model is proposed for UV-CMP of optical glass with the synergistic effect of ultrasonic vibration, SiO 2 abrasives, K 2 CO 3 and KH550. Ultrasonic vibration accelerates the hydration reaction rate of optical glass, generating Si-OH. Concurrently, it promotes the hydrolysis of KH550, forming Si-O and C-NH 2 chemical bonds. This research reveals that UV-CMP demonstrates great potential for precision machining of silicon-based optical materials and provides a new direction for efficient manufacturing of optical components.