Baijun Chen, Ning Shang, 义胜 姚, Guisheng Liang, Xia Feng, Hui Zhang, Shangqing Zhu, Yi Hou, Lixi Wang
Abstract The rapid advancement of electronic devices toward miniaturization and lightweight design has intensified the challenges of electromagnetic interference and thermal management. The Al 2 O 3 @CUF@g-C₃N₄ composite synergistically integrates broadband microwave absorption and high thermal conductivity to address this challenge. The aligned CUF network offers a high attenuation constant at low frequency and continuous 3D pathways for electron/phonon transport. The g-C₃N₄ coating further enhances performance by introducing abundant interfaces and leveraging its intrinsic thermal conductivity. The optimized composite achieves an effective absorption bandwidth (EAB) of 4.00 GHz (4.00 ~ 8.00 GHz), fully covering the n79 band (4.4 ~ 5.0 GHz) for 5G communications. At 3.10 mm thickness, the EAB extends to 7.8 GHz. Additionally, the in-plane thermal conductivity (λ ∥ ) of the composite reaches 2.77 W·m⁻¹·K⁻¹, representing an 18-fold enhancement over random CUF (0.147 W·m⁻¹·K⁻¹). This integrated design coupling of 0D particles, 1D fibers, and 2D sheets, enables the formation of multiple thermal conduction and microwave attenuation pathways.