Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

Abstract Power electronics devices advance to meet growing demands for efficiency and die‐attach technologies play a crucial role in ensuring thermal and mechanical performance in power electronics packaging. Among die‐attach technologies, Transient Liquid Phase (TLP) Bonding emerges as a promising technology, utilizing combinations of high‐ and low‐melting‐point materials to form intermetallic compounds with high thermal stability and mechanical strength. While TLP Bonding is widely explored for joining of composites and ceramics, its implementation in power electronics packaging introduces new challenges, including differences in material behavior, diffusion kinetics, and interfacial reactions at micro‐ and nanoscales. This review outlines the current state of research on TLP Bonding in die‐attach applications, covering key processing conditions, reliability aspects, and optimization strategies. Many experimental studies adopt simplified test setups that do not fully replicate industrial baseline requirements, limiting the direct applicability of research findings. To bridge this gap, this review aims to unify terminology, contextualize experimental approaches, and highlight the key challenges to be addressed for successful industrial adoption. It also discusses emerging trends, such as the use of nanostructured interfaces to accelerate the TLP bonding process, offering new pathways to enhance the scalability of this technology.