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◆ Advanced Functional Materials2026-04-13· Materials science

Figueira Cheese‐Inspired Hierarchical Nanocomposites: Combining Ultralow Percolation and Breathability Toward Full‐Lifecycle Circular Epidermal Electronics

Kangjia Geng, Yuduo Zhang, Mengting Zheng, Chuai Tian, Yuyang Zhou, Hao Qiu, Chang Zhou, Jiayu Hou, Haijun Zhu, Yuchen Wang, Yidong Peng, Hailong Liu, Guanzheng Wu, Steve Park, Yongsheng Luo, Yunpeng Huang, Jiancheng Dong, Tianxi Liu

原始摘要(英文原文)· Original abstract
ABSTRACT Simultaneously achieving high electrical conductivity, mechanical compliance, and breathability remains a critical bottleneck for epidermal electronics. Conventional composites typically suffer from trade‐offs between filler loading and softness while often lacking necessary permeability or recyclability. Here, we report a sustainable phase‐separated nanocomposite mimicking the hierarchical porous texture of Figueira cheese. Our synthesis leverages distinct solvent solubility and volatility differences to orchestrate a kinetic phase separation, driving silver nanowires to self‐assemble along a porous elastomer skeleton. This architecture decouples electrical performance from mechanical constraints, exhibiting a high conductivity of 2.8 × 10 5 S m − 1 and a water vapor transmission rate exceeding 1200 g m − 2 day − 1 . Additionally, its Young's modulus of 0.45 MPa (Shore A hardness 28) ensures intimate conformity to skin. Featuring an ultralow percolation threshold of 0.00119 vol% and exceptional strain insensitivity, the nanocomposite enables stable Joule heating and electrophysiological monitoring. Crucially, the material supports efficient closed‐loop recycling, recovering both elastomer and fillers. Even after 4 life cycles, it retains over 75% conductivity and fully preserves functionality for high‐fidelity electrophysiological monitoring. This work establishes a paradigm for sustainable, high‐performance epidermal electronics.
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Figueira Cheese‐Inspired Hierarchical Nanocomposites: Combining Ultralow Percolation and Breathability Toward Full‐Lifecycle Circular Epidermal Electronics — 科研速览 Science Skim