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◆ Advanced Functional Materials2025-12-03· Materials science

Advances in Soft Solid State Electrocaloric Refrigeration

Shumao Xu, Xiujun Fan, Songyue Chen, Jeong Min Baik, Jun Chen

原始摘要(英文原文)· Original abstract
Abstract Electrocaloric cooling has emerged as a promising solid‐state substitute for traditional vapor‐compression refrigeration, driven by the need for environmentally friendly and energy‐efficient technologies. This review hightlights recent advances in ceramic ferroelectrics in multilayer ceramic capacitors (MLCCs) and polyvinylidene fluoride (PVDF) copolymers‐based efficient, self‐oscillating soft refrigeration systems. The introduction of lead‐free ceramic ferroelectrics in MLCCs has significantly enhanced the performance and durability of electrocaloric cooling systems, making them energy‐efficient and capable of withstanding extensive operational cycles. Simultaneously, ternary copolymers, P(VDF‐TrFE‐CFE) and P(VDF‐TrFE‐CTFE) along with their composites and modified derivatives have demonstrated superior promise due to their enhanced polarization‐field coupling and fatigue resistance compared to irradiated copolymers. These systems leverage their high thermal conductivity and substantial electrocaloric responses to facilitate rapid heat dissipation without external mechanical components, enabling efficient electronic thermal management. The synergy between electro‐thermomechanical properties has paved the way for these solid‐state cooling technologies to potentially replace conventional systems, reducing energy consumption and eliminating the use of harmful refrigerants. This review underscores the pivotal role of molecular and interface engineering in eco‐friendly electrocaloric cooling solutions, focusing on enhancing cooling efficiency through optimized thermal load management, strategic dipole alignment to improve polarization‐field interaction, and the development of ceramic multilayer capacitors and irradiated P(VDF‐TrFE) with large adiabatic temperature changes and high energy densities, promising electronic thermal management and on‐chip cooling in advanced computing and telecommunications.
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